Description
Specifications
The 2UUL GS183 high-precision solder paste is the ideal consumable product for demanding electronics repair technicians. Designed for BGA chip upgrades and integrated circuit replacement, this formulation features a very stable eutectic melting temperature at 183 °C. Thanks to the Sn63/Pb37 alloy blend and type 4 particle size distribution, it ensures reliable soldering. The integrated no-clean flux does not require washing process updates.
- Type
- Paste
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.