Solder with flux, produced from the first melting of tin and molybdenum according to the PN EN 29453:2000 standard, in a continuous casting process without exposure to air, and then extruded to eliminate the appearance of oxides. The solder has a thickness of 2.5 mm and a weight of 100 g, with tin content ranging from 59.5% to 60.5%, and a melting temperature between 183°C and 190°C. The SW26 flux is based on resin and an organic chlorine activator, which, after soldering, is "bound" to the resin, preventing direct contact with the solder and avoiding corrosion, while facilitating melting and increasing the fluidity of the solder.

Purpose / Use
The solder is used mainly in the electronics industry for the production of standard devices and electronic components, as well as in electrical engineering.