Solder from alloy with flux, produced from the first melting of tin and lead according to standard PN EN 29453:2000. The process is continuous casting without exposure to air, followed by extrusion to eliminate the presence of oxides. The alloy has a thickness of 3.0 mm and a weight of 100 g, with tin content ranging from 59.5% to 60.5% and a melting temperature between 183°C and 190°C.

The SW26 flux is based on resin and an organic halogen activator, which after soldering is "bound" into the resin, preventing direct contact with the solder and avoiding corrosion, while also facilitating melting and increasing the fluidity of the solder.

• Primarily used in the electronics industry for the production of standard devices and electronic components.
• Application in electrical engineering.