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Hydronaut Pro is a thermal paste designed for high-performance systems with large cooling surfaces, such as water cooling systems. It is also suitable for industrial applications, as it is free of silicone. Ideal for overclocking applications.
The Hydronaut Pro thermal paste features an optimized formulation that makes it suitable for industrial systems and high-performance computer systems. Thanks to its excellent thermal conductivity, it is particularly well suited for applications with large cooling surfaces, such as gaming PCs with custom water cooling. It combines high performance with an attractive price-to-value ratio.
Free of Silicone for Industrial Systems
The Hydronaut Pro thermal paste contains a silicone-free carrier structure. Many thermal pastes use silicone as a liquid carrier or as part of the matrix. Under thermal stress, especially during temperature fluctuations, changes in the paste may occur, such as leakage from the contact area. This migration mechanism from the contact surface is known as the pumping effect. While this is usually not critical in normal computer use, silicone leakage can be undesirable in industrial applications.
Compatible Accessories
For optimal application, the TG Spatula Pro is included with Hydronaut Pro. The revised spatula design allows increased pressure during application, ensuring effective spreading and a thinner layer of thermal paste.
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