Duronaut Pro Silicon-Free for Industrial Systems

The Hydronaut Pro thermal paste features a silicone-free carrier structure. In many thermal pastes, oil-based silicone products (e.g., siloxanes) are used as the transfer fluid or as a component of the matrix. Under thermal stress, especially during temperature fluctuations, changes in the paste can occur, such as leakage and displacement of the paste from the contact area. Repeated temperature fluctuations as well as micro-movements between the CPU IHS and the heatsink base can intensify this effect. The mechanical displacement of the paste from the contact surface is referred to as the pump-out effect. In normal computer use, this is generally not critical. However, in industrial applications, leakage of oily silicone can be undesirable, especially if adjacent materials or sealing materials (e.g., certain EPDM or NBR seals) are incompatible with silicone oils. This can lead to swelling or changes in the properties of the materials. The product is RoHS compliant and designed as an easy-to-apply thermal interface material for demanding users.

Compatible Accessories

For optimal application, the TG Spatula Pro is included with the Hydronaut Pro. The revised design of the spatula allows increased pressure during application, ensuring effective spreading and a thinner layer of thermal paste.

Package Contents

• 1x Hydronaut Pro 30g
• 1x TG Spatula
• 1x TG Spatula Pro