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U6-PRO Upsiren Putty Filler 20gr
Putty Fillers

U6-PRO Upsiren Putty Filler 20gr

Upsiren U6-PRO thermal putty fills small gaps between low-profile heatsinks and components such as VRAM, VRMs, and controllers. Its soft, slightly tacky texture stays in place and accommodates small...

Upsiren U6-PRO thermal putty fills small gaps between low-profile heatsinks and components such as VRAM, VRMs, and controllers. Its soft, slightly tacky texture stays in place and accommodates small height differences, making it suitable for 1–2 mm interface gaps. Its thermal conductivity is 12.8 W/mK.

  • Weight: 20 g
  • Application surface: Plastic
  • Texture:...
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Product report

Description & Specifications

Upsiren U6-PRO thermal putty fills small gaps between low-profile heatsinks and components such as VRAM, VRMs, and controllers. Its soft, slightly tacky texture stays in place and accommodates small height differences, making it suitable for 1–2 mm interface gaps. Its thermal conductivity is 12.8 W/mK.

  • Weight: 20 g
  • Application surface: Plastic
  • Texture: Soft, slightly tacky
  • Interface thickness: 1–2 mm
  • Thermal conductivity: 12.8 W/mK
  • Package contents: 20 g jar of putty, plastic spatula, 2 finger cots

Manufacturer

Manufacturer Details

Warnings & Safety Information

Dimensions

Application Surface
Plastic
Sanding Capability
No
No Shrinkage / Crack Resistance
No

Quantity

Weight
0.02 kg

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.