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Gelid Solutions Thermal Paste transfers heat with a thermal conductivity of 7 W/m·K and forms a thin layer between the processor and the heatsink. It does not flow or dry out, and is easy to remove even after extended use. Its nanoparticles fill tiny gaps, while the paste itself is non-conductive.
It can be used on memory modules, CPUs, motherboard power components, and GPUs.
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.