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Gelid GC-Pro thermal conductive paste, 5g capacity, with thermal conductivity of 7 W/m·K. It does not flow or dry out and forms a thin layer between the processor and the heatsink. It is easily removable even after long-term use. The nanoparticles fill small gaps, while the paste is electrically non-conductive and can be used on memory, CPU, motherboard power elements, and GPU.
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