Thermal Paste

Termopasty AGT-180 Thermal Paste 120gr

The thermal conductive adhesive AG TermoGlue is intended for securing heatsinks to memory modules, transistors, or bridges. It is used for bonding and filling gaps between heating elements.

  • Maximum...

The thermal conductive adhesive AG TermoGlue is intended for securing heatsinks to memory modules, transistors, or bridges. It is used for bonding and filling gaps between heating elements.

  • Maximum allowable thickness: 6 mm
  • Color: White
  • Drying time: approximately 24 hours
  • Quantity: 120g
  • Code: ART.AGT-180
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Description

Description

The thermal conductive adhesive AG TermoGlue is intended for securing heatsinks to memory modules, transistors, or bridges. It is used for bonding and filling gaps between heating elements.

  • Maximum allowable thickness: 6 mm
  • Color: White
  • Drying time: approximately 24 hours
  • Quantity: 120g
  • Code: ART.AGT-180

Manufacturer

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Specifications

Specifications

Quantity
120 gr
Usage
-

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.

See all specifications

Description & Specifications

The thermal conductive adhesive AG TermoGlue is intended for securing heatsinks to memory modules, transistors, or bridges. It is used for bonding and filling gaps between heating elements.

  • Maximum allowable thickness: 6 mm
  • Color: White
  • Drying time: approximately 24 hours
  • Quantity: 120g
  • Code: ART.AGT-180

Manufacturer

Quantity
120 gr
Usage
-

Important information

Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.

45,90 €
14,00 €   shipping cost