The thermal conductive adhesive AG TermoGlue is intended for securing heatsinks to memory modules, transistors, or bridges. It is used for bonding and filling gaps between heating elements.
- Maximum allowable thickness: 6 mm
- Color: White
- Drying time: approximately 24 hours
- Quantity: 120g
- Code: ART.AGT-180
- Quantity
- 120 gr
- Usage
- -
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.