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Flexible thermal pad Gelid for applications requiring high thermal conductivity material, such as:
Its soft structure is suitable for irregularly shaped components and for filling gaps from microscopic scratches to visible uneven surfaces. It can be cut to desired dimensions.
Thermal conductivity: 7W/mK
Dimensions: 120x20x1.5mm
Model: TP-GP03-C
Before use, remove the protective film from both sides.
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.