Gelid Solutions thermal paste is suitable for use on processor heatsinks, graphics cards, and chipsets. It has an ultra-fine molecular structure and is electrically non-conductive, non-flammable, and non-corrosive.
- Thermal conductivity: 7.00 W/mK
- Density: 2.8 g/cm³
- Color: Gray
- Viscosity: 170000 poise
- Packaging: Syringe
- Operating temperature: -45 to 240 °C
- Quantity: 1 g
- Package contents: GELID applicator
- Quantity
- 1 gr
- Usage
- -
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.