Gelid Solutions thermal paste is a synthetic thermally conductive material for transferring heat from processors, memory modules, and motherboard power components. It does not leak or dry out and can be applied with the included spatula.

• Quantity: 10 g
• Thermal conductivity: >4.5 W/mK
• Viscosity: 1000 Poise
• Density: 2.3 g/cm³
• Operating temperature: -30 to 150 °C
• Color: Gray
• Packaging: Syringe
• Package contents: Spatula