In the category Various Mobile Spare Parts, the melting temperatures for lead solder balls are as follows:

• Lead melting temperature: 180°C with an optimal melting temperature of 210°C-215°C.
• Lead-free melting temperature: 217°C with an optimal melting temperature of 235°C-245°C.

The above temperatures refer to the actual temperatures of the chip solder balls and are measured with the measuring wire on the BGA machine. It is important to note that these temperatures do not represent the temperatures from the heating guns of the BGA rework station. When soldering a new chip with lead solder balls using the lead-free temperature profile, there is a risk of overheating the new chip. Similarly, when soldering a new chip with lead-free solder balls using the lead temperature profile, the old lead-free solder balls on the new chip may not fully melt. Advanced soldering skills are recommended for handling the chips to be ordered.