Description
Specifications
The Amaoe V3.0 reballing stencil for CPU repair and rework is used for BGA reballing. It is compatible with the iPhone 15 series and is 0.12 mm thick.
- Type: BGA reballing stencil
- Use: CPU rework and repair
- Thickness: 0.12 mm
- Compatibility: iPhone 15 series
Manufacturer
OEM- Type
- Reballing Stencil
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.