Description
Specifications
CSGR K5 Pro thermal putty replaces soft thermal pads on VRAM, VRMs, controllers, and uneven contact areas with the heatsink. It has a thermal conductivity of >5.3 W/mK and fills gaps of up to approximately 3 mm without cutting or stacking thermal pads. The moldable material is electrically non-conductive and adapts to different heights.
It is used in laptops, consoles, desktop graphics cards, and electronics repairs.
- Quantity: 60 g
- Packaging: 6 tubes of 10 g each
- Thermal conductivity: >5.3 W/mK
- Maximum gap-filling height: approximately 3 mm
- Electrical conductivity: Non-conductive
- Country of manufacture: Greece
- Package contents: 6 tubes of thermal putty, wooden applicator, instruction leaflet
- Quantity
- 60 gr
- Usage
- -
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.