Description
Specifications
CSGR thermal paste is a high-viscosity material for filling larger gaps of 2–4 mm in VRAM, VRM and cold plates. It conforms to the shape of the gaps for stable contact and has a thermal conductivity of 16.8 W/mK.
- Quantity: 20 g
- Thermal conductivity: 16.8 W/mK
- Viscosity: High
- Applications: VRAM, VRM and cold plates
- Gap filling: 2–4 mm
- Quantity
- 20 gr
- Usage
- -
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.