Description
Specifications
Upsiren Ux Pro Ultra thermal putty can be shaped into strips or pads to make contact with uneven surfaces. It is designed for 2–4 mm gaps on VRAM, VRM and cold plates, and has a thermal conductivity of 16.8 W/mK.
The package includes a plastic spatula and two finger covers.
- Weight: 50 g
- Viscosity: High
- Thermal conductivity: 16.8 W/mK
- Application: 2–4 mm gaps on VRAM, VRM and cold plates
- Form: Strips or pads
- Application surface: Plastic
- Package contents: 50 g jar of thermal putty, plastic spatula, 2 finger covers
Dimensions
- Application Surface
- Plastic
- Sanding Capability
- No
- No Shrinkage / Crack Resistance
- No
Quantity
- Weight
- 0.05 kg
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.