Description
Specifications
Upsiren U6 Pro thermal putty is applied to VRAM, VRM and controller areas, as well as to locations where thin heatsinks need to make contact. Its soft, slightly tacky texture stays in place and compensates for small height differences across 1–2 mm interfaces. Its thermal conductivity is 12.8 W/mK.
- Quantity: 100 g
- Weight: 0.1 kg
- Thermal conductivity: 12.8 W/mK
- Application surface: Plastic
- Interface thickness: 1–2 mm
- Applications: VRAM, VRM and controllers
- Country of manufacture: Greece
- Package contents: 100 g jar of thermal putty, plastic spatula and 2 finger protectors
Dimensions
- Application Surface
- Plastic
- Sanding Capability
- No
- No Shrinkage / Crack Resistance
- No
Quantity
- Weight
- 0.1 kg
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.