Qoltec Thermal Putty 10 W/m-K is a thermally conductive compound designed to improve heat transfer between heat-generating electronic components and cooling components. Thanks to its thick, flexible consistency, it conforms precisely to surfaces and fills small irregularities and gaps, minimizing the formation of air bubbles that impede heat conduction.

Key features:

• Thermal conductivity of 10 W/m-K for effective heat dissipation.
• Improved heat transfer between the component and the heatsink.
• High quality: the compound’s properties do not deteriorate over time, ensuring consistent, long-lasting performance.
• Thick, flexible consistency that makes application easier and allows it to precisely fill all the tiny gaps between individual components.
• Contents: 10 g net weight.

The flexible consistency of Thermal Putty allows it to fill larger gaps between the component being cooled and the heatsink, making it ideal for applications in hard-to-reach areas.

The package contains 10 g of pink thermal paste, suitable for occasional repairs and more frequent maintenance, making it a practical solution for computer repair shops and electronics technicians.