Qoltec Thermal Putty 8 W/m·K is a thermal material designed to improve heat transfer between heat-generating electronic components and cooling elements.

• Effective thermal conductivity: 8 W/m·K for efficient heat transfer.
• Adaptable consistency: Dense and flexible, allowing precise coverage of all microscopic gaps.
• Compatibility: Suitable for integrated circuits, memory, power supply components, and other thermal elements.
• Contents: 10 g net weight.

This thermal putty offers high thermal conductivity, excellent insulation, and easy application, making it possible to fill larger gaps between a component and a heatsink.

Its dense consistency allows for precise application, even in hard-to-reach areas. Ideal for repairs, technical applications, and equipment maintenance by computer shops and electronics technicians.