Qoltec Thermal Putty 4 W/m·K is a thermal material designed to improve heat transfer between heat-generating electronic components and cooling elements. Its dense, pliable texture conforms precisely to surfaces and fills small irregularities and gaps, minimizing air bubbles that can hinder heat dissipation.

• Thermal conductivity: 4 W/m·K, ensuring efficient heat transfer to heatsinks and other cooling system components.
• Improves thermal contact between the component and the heatsink.
• High thermal conductivity and excellent insulation.
• Dense, pliable texture that precisely fills microscopic gaps between components.
• Contents: 10 g net weight.

Compared with traditional thermal pastes, Thermal Putty’s texture allows it to fill larger gaps between a component and a heatsink, making it easier to apply in hard-to-reach areas.

The package contains 10 g of pink thermal putty, making it suitable for occasional repairs and regular maintenance. It is a practical solution for computer repair shops, electronics technicians, and users who maintain and upgrade equipment.