Description
Specifications
CSGR thermal paste is a liquid metal thermal interface material for use with CPUs and GPUs. It has a thermal conductivity of 79 W/mK and is designed for application to the die.
- Quantity: 1 g
- Use: CPU/GPU
- Form: Liquid metal
- Thermal conductivity: 79 W/mK
- Quantity
- 1 gr
- Usage
- CPU/GPU
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.