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Qianli Bumblebee Stencil Qs163 Emmc Emcp Ufs
Mobile Phone Repair Tools

Qianli Bumblebee Stencil Qs163 Emmc Emcp Ufs

The Qianli Bumblebee Stencil QS163 is a BGA stencil for servicing eMMC, eMCP and UFS memory chips. It features square apertures with rounded corners, while its new processing and materials make it...

The Qianli Bumblebee Stencil QS163 is a BGA stencil for servicing eMMC, eMCP and UFS memory chips. It features square apertures with rounded corners, while its new processing and materials make it easier to use and provide greater precision.

  • Type: BGA stencil
  • Compatibility: eMMC, eMCP, UFS
  • Aperture shape: Square with rounded corners
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Description & Specifications

The Qianli Bumblebee Stencil QS163 is a BGA stencil for servicing eMMC, eMCP and UFS memory chips. It features square apertures with rounded corners, while its new processing and materials make it easier to use and provide greater precision.

  • Type: BGA stencil
  • Compatibility: eMMC, eMCP, UFS
  • Aperture shape: Square with rounded corners

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Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.