The Gelid Solutions Thermal Pad uses phase change material (PCM), which becomes pliable at 45 °C and fills the microscopic gaps between the processor or graphics card and the heatsink. It has a thermal conductivity of 8.5 W/mK and operates at temperatures from -50 to 125 °C.
- Technology: Phase change (PCM)
- Phase change temperature: 45 °C
- Thermal conductivity: 8.5 W/mK
- Operating temperature range: -50 to 125 °C
- Density: 2.8 g/cm³
- Volume resistivity: 1.0 x 10² Ω·cm
- Color: Gray
- Thickness: 0.2 mm
- Width: 100 mm
- Length: 100 mm
Main Specifications
- Type
- Thermal Pad
- Colour
- Grey
Thermal Pad Dimension
- Length
- 100 mm
- Width
- 100 mm
- Thickness
- 0.2 mm
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.