Termopasty H thermal paste is silicone-based and intended for use between CPU/GPU processors and heatsinks. It consists of silicone and zinc oxide and is electrically non-conductive. Its thermal conductivity is greater than 0.88 W/mK, and it does not flow after application.
It is also used in applications involving temperature sensors, LEDs, storage devices, power supplies, and cooling systems. To apply, clean the surfaces and spread a small amount evenly over the component surface, avoiding electrical contacts.
- Quantity: 25 g
- Use: CPU/GPU
- Composition: Silicone and zinc oxide
- Colour: White
- Thermal conductivity: >0.88 W/mK
- Operating temperature: From -50 °C to 250 °C
- Electrical insulation resistance: 3.7 × 10¹⁵ Ω × cm
- Dielectric constant: 8.0 at 120 Hz
- Dielectric loss factor (tg δ): 0.016 at 120 Hz
- Package contents: Syringe containing 25 g of paste
- Storage: Store in a cool, dry place
- Quantity
- 25 gr
- Usage
- CPU/GPU
Important information
Specifications are collected from official manufacturer websites. Please verify the specifications before proceeding with your final purchase. If you notice any problem you can report it here.